IPC Training IPC-A-610IPC Training IPC-A-610

IPC-A-610 Training

Acceptability of Electronic Assemblies Training and Certification Program:

With its comprehensive criteria for printed circuit board assemblies, IPC-A-610 is the most widely used inspection standard in the electronics industry — and has earned an international reputation as the source for end-product acceptance criteria for consumer and high reliability printed circuit assemblies. Now updated to lead-free, and available in many languages, IPC-A-610 has been embraced by original equipment manufacturers and electronics manufacturing services companies worldwide. This training is available in several languages.

Topics Covered in the IPC-A-610 Endorsement Program

  • Establishing and maintaining the integrity of the certification program
  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead-free connections
  • Soldered requirements for connecting to terminals
  • Soldered connection requirements for plated-through holes
  • Surface mounting criteria for chip components, leadless and leaded chip carriers
  • Swaged hardware and heatsink requirements of mechanical assemblies
  • Component mounting criteria for DIPS, socket pins and card edge connectors
  • Jumper wire assembly requirements
  • Solder fillet dimensional criteria for all major SMT component groups
  • Soldering anomalies, such as tombstoning, dewetting, voiding and others
  • Criteria for component damage, laminate conditions, cleaning and coating
  • Steps to effectively using the lesson plan and materials, tips on inspection

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Acceptability of Electronic Assemblies Training and Certification Program:

With its comprehensive criteria for printed circuit board assemblies, IPC-A-610 is the most widely used inspection standard in the electronics industry — and has earned an international reputation as the source for end-product acceptance criteria for consumer and high reliability printed circuit assemblies. Now updated to lead-free, and available in many languages, IPC-A-610 has been embraced by original equipment manufacturers and electronics manufacturing services companies worldwide. This training is available in several languages.

Topics Covered in the IPC-A-610 Endorsement Program

  • Establishing and maintaining the integrity of the certification program
  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead-free connections
  • Soldered requirements for connecting to terminals
  • Soldered connection requirements for plated-through holes
  • Surface mounting criteria for chip components, leadless and leaded chip carriers
  • Swaged hardware and heatsink requirements of mechanical assemblies
  • Component mounting criteria for DIPS, socket pins and card edge connectors
  • Jumper wire assembly requirements
  • Solder fillet dimensional criteria for all major SMT component groups
  • Soldering anomalies, such as tombstoning, dewetting, voiding and others
  • Criteria for component damage, laminate conditions, cleaning and coating
  • Steps to effectively using the lesson plan and materials, tips on inspection

| Read More