Manufacturers and assemblers that want to realize dramatic cost savings by repairing and reworking electronic assemblies and printed circuit boards know the benefits of IPC-7711/7721. This widely used standard offers a wealth of industry-approved techniques on through-hole and surface-mount rework as well as land, conductor and laminate repair. It covers procedural requirements, tools, materials and methods for removing and replacing conformal coatings, surface mount and through-hole components. The standard also includes procedures for repairing and modifying boards and assemblies. In addition, it is now updated with additional support for lead-free, BGAs and flex-print repairs.
Topics Covered in the IPC-7711/7721 Endorsement Program
- Product classifications, skill levels, tools and materials
- Basic surface mount and through-hole component removal
- Land preparation and component installation
- Primary heating methods: conductive, convective and others
- Handling electronic assemblies
- Wire splicing procedures
- Through-hole component removal and installation
- Chip and MELF rework procedures
- SOIC/SOT, J-lead and QFP rework
- Printed wiring board circuit and laminate repair
- Conformal coating removal
